ACAMP employs leading-edge simulation software applications for product development that offer Finite element analysis covering a wide range of physics: structural, thermal, fluid dynamics, magnetic, electric, electrostatics, and electromagnetics. Full 3D electromagnetic simulations. RF board design. System-level simulation based on block diagrams. Ray tracing and illumination modeling for optical assemblies. Injection molding, including filling, packing, cooling and warping. 3D EM simulation of high frequency components.

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